
Page 26
Epson Research and Development
Vancouver Design Center
SED1352
Hardware Functional Specification
X16-SP-001-16
Issue Date: 99/07/28
6 D.C. CHARACTERISTICS
Table 6-1: Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
V
DD
Supply Voltage
V
SS
- 0.3 to + 6.5
V
V
IN
Input Voltage
V
SS
- 0.3 to V
DD
+ 0.3
V
V
OUT
Output Voltage
V
SS
- 0.3 to V
DD
+ 0.3
V
T
STG
Storage Temperature
-65 to 150
°
C
T
SOL
Solder Temperature/Time
260 for 10 sec. max at lead
°
C
Table 6-2: Recommended Operating Conditions
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
DD
Supply Voltage
V
SS
= 0V
2.7
3.0/3.3/5.0
5.5
V
V
IN
Input Voltage
V
SS
--
V
DD
V
I
OPR
Operating Current
f
OSC
= 6 MHz,
16 grays
3.0/3.5/7.0
mA
T
OPR
Operating Temperature
-40
25
85
°
C
P
TYP
Typical Active Power Consumption
f
OSC
= 6 MHz,
16 grays
9.0/11.55/35.0
mW
Table 6-3: Input Specifications
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
IL
Low Level Input Voltage
V
DD
= 4.5V
V
DD
= 3.0V
V
DD
= 2.7V
0.8
0.6
0.5
V
V
IH
High Level Input Voltage
V
DD
= 5.5V
V
DD
= 3.6V
V
DD
= 3.3V
2.0
2.5
2.3
V
V
T+
Positive-going Threshold
V
DD
= 5.0
V
DD
= 3.3
V
DD
= 3.0
2.4
2.4
2.3
V
V
T-
Negative-going Threshold
V
DD
= 5.0
V
DD
= 3.3
V
DD
= 3.0
0.6
0.6
0.5
V
V
H
Hysteresis Voltage
V
DD
= 5.0
V
DD
= 3.3
V
DD
= 3.0
0.1
0.1
0.1
V
I
IZ
Input Leakage Current
--
-1
1
µ
A