turck TBIP-L...-FDIO1-2IOL Series TBIP-L4-FDIO1-2IOL, Instructions For Use Manual

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Mounting
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4.3 Grounding the Device
The grounding/shielding concept of the TBxx-devices allows the separate grounding of fieldbus-
and I/O-part
1 nF
2,2 MΩ
X1
C0
C1
C2
C3
P1
X2
C4
C5
C6
C7
P2
4 x 15 nF
Fig. 7: Equivalent circuit diagram, shielding con-
cept
1
2
3
Fig. 8: Grounding components
The metal clamp (1) at the M12-connectors for the fieldbus connection (P1, P2) connects the shield
of the fieldbus lines.
The metal ring (2) is situated under the metal clamp an connects the functional earth of the

7/8'' connectors (pin 3) for the voltage supply to the FE of the M12-connectors (pin 5) for the con-
nection of the sensors and actuators.
By mounting the module onto a mounting plate through the mounting hole, the mounting screw
is used to realize the connection to the reference potential of the installation.
1 metal clamp
2 Metal ring
3 Mounting screw