Galaxy A16F-R2431 Installation and Hardware Reference Manual
2-2
Safety Precautions
5.
Memory modules:
If you wish to change the pre-installed DDR RAM
DIMM module, the separately purchased module(s) must be installed.
(See
Chapter 5
)
6.
BBU:
If you wish to install a BBU, the BBU must be purchased
separately and installed prior to powering on the subsystem. (See
Section 2.8
)
7.
Rack installation:
The enclosure chassis can be installed into a rack
cabinet using separately purchased mounting rails, rear-attached
brackets, or
GAL-9273Cslider28
and
GAL-9273Cslider36
rackmount
brackets. (See
Section 2.9
)
2.3 Safety
Precautions
2.3.1
Precautions and Instructions
1.
Please read these instructions carefully.
2.
Please disconnect two (2) power cords from AC outlets before servicing
or cleaning. Don‘t use liquid or sprayed detergent for cleaning. Use a
slightly moistened paper sheet or clothe for cleaning.
3.
Rack-mounting the enclosure – The subsystem is intended to be rack-
mounted, the following concerns should be heeded when installing the
enclosure into a rack cabinet.
a.
The rack cabinet and the associated equipment at the
installation site should be able to maintain an ambient
temperature (around the chassis) lower than 40
°
C and 35
°
C is
battery backup is applied.
b.
The openings on the enclosure are for air convection through
the interior of the chassis. DO NOT COVER THE
OPENINGS.
c.
The rack cabinet into which this enclosure is installed must
support overcurrent protection and must not be overloaded by
the modules installed. Other requirements, such as ventilation
airflow, rack stabilizing features, electrical earth, and electrical
distribution, must comply with the technical specifications
listed in the documentation or safety labels that came with this
product.
d.
Consideration should be given to the connection of the
subsystem to the supply circuit and the effect that overloading
of circuits might have on over-current conditions.
