Galaxy A16F-R2431 Installation and Hardware Reference Manual
1-4
Major Subsystem Components
Once the subsystem is rebooted, all system configurations revert to the
default stage so that
Controller A
becomes the primary controller and
Controller B
the secondary controller.
BBUs:
Two (2) BBUs come as standard equipment for dual-
controller A16F-R2431. Each BBU sustains cache memory for
days during a power outage to prevent data loss. These BBUs are
hot-swappable. (See
Section 1.3.6.
)
PSUs:
The hot-swappable, load-sharing PSUs convert 110V or
240V input to 3.3V, 5V, or 12V for subsystem components.
Subsystem power-on/off is controlled by a power switch on each
PSU. (See
Section 1.3.7.
) These modules contain the subsystem’s
cooling modules. The redundant cooling modules ventilate the
chassis with an airflow traveling from the front to the rear. (See
Section 1.3.8.
)
1.2.3 Integrated
Backplane
An integrated backplane board separates the front and rear sections of the
chassis. This circuit board provides logic level signals and low voltage
power paths. Thermal sensors and I
2
C devices are implemented to detect
system temperature and PSU/cooling module presence signals. This board
contains no user-serviceable components.
1.2.4 Physical
Dimensions
The A16F subsystem comes in an enhanced 3U chassis with the following
dimensions:
With handles: 488.6mm (W) x 131mm (H) x 504.3mm (L) (19 x
5.2 x 21 inches)
Without handles: 445mm x 130mm x 488.2mm (17.5 x 5.1 x 19.2
inches)
1.3 Major Subsystem Components
The subsystem chassis houses many active components and most of them
can be accessed through either the front or rear panel. The modular
enclosure design facilitates the ease of installation and maintenance
procedures. Hot-swap mechanisms are incorporated to eliminate power
surges and signal glitches that might occur while removing or installing
these modules. Each component is further described below:
