20
IIMS01J02-E2
3. MOUNTING
This chapter describes the mounting procedures for the H-PCP-J modules. For details of the mounting
procedures for other modules and the mounting position of the control unit, see the
Hardware Quick
Manual
(IMS01V01-E )
.
3.1 Mounting Cautions
(1) This instrument is intended to be used under the following environmental conditions. (
IEC61010-1)
[OVERVOLTAGE CATEGORY II, POLLUTION DEGREE 2]
(2) Use this instrument within the following ambient temperature and ambient humidity.
•
Ambient temperature: 0 to 50
°
C
•
Ambient humidity:
45 to 85 % RH
(Absolute humidity: MAX. W. C 29 g/m
3
dry air at 101.3 kPa)
(3) Avoid the following conditions when selecting the mounting location:
•
Rapid changes in ambient temperature which may cause condensation.
•
Corrosive or inflammable gases.
•
Direct vibration or shock to the mainframe.
•
Water, oil, chemicals, vapor or steam splashes.
•
Excessive dust, salt or iron particles.
•
Excessive induction noise, static electricity, magnetic fields or noise.
•
Direct air flow from an air conditioner.
•
Exposure to direct sunlight.
•
Excessive heat accumulation.
To prevent electric shock or instrument failure, always turn off the power before
mounting or removing the modules.
WARNING
!
