Reference: Mean Time Between Failures (MTBF) Data
105
Chapter 15
Reference: Mean Time Between Failures (MTBF) Data
The following table provides MTBF data.
Assumptions:
1.
The calculation is performed using the
RelCalc for Windows V5.1-TELC3
software, which
implements Telcordia SR-332 (Issue 3) failure rate models.
2.
The operating internal chassis temperature is 40°C. The calculation assumes the temperature across
the boards is relatively constant.
3.
The Telcordia environment is GB.
4.
Each part’s operating current/voltage/power stress is 50%.
5.
The typical operating power value (as specified in the component’s datasheet) is used for each IC
and semiconductor.
6.
The calculation uses the 90% UCL (Upper Confidence Level) Telcordia Issue 3 model.
7.
Each part’s Telcordia Quality Level is I.
Table 29: MTBF Data
Model
MTBF @ 40°C
CL-GigE External Frame Grabber
1,014,151 hours
