Industrial Automation Wiring and Grounding Guidelines
E115P
4
Mounting, Bonding, and Grounding
After establishing all layouts, you can begin mounting,
bonding, and grounding each chassis. Bonding is the
connecting together of metal parts of chassis, assemblies,
frames, shields, and enclosures to reduce the effects of
EMI and ground noise. Grounding is the connection to
the grounding-electrode system to place equipment at
earth ground potential.
Figure 1 – Mounting Assembly Details
Enclosure Wall
I/O Block
Transformer
Use greater
spacing
without conduit
Tighter spacing
allowed with conduit
Tighter spacing allowed
where forced by spacing
of connection points
Place modules to
comply with spacing
guidelines if possible
Category-1
Conductors
(AC Power Lines)
Category-2
Conductors
Category-2
Conductors
Conduit
1771 I/O Chassis
Conduit
Summary of Contents for H Series
Page 135: ...DeviceNet Media Design and Installation Guide...
Page 144: ...Publication DNET UM072C EN P July 2004 Table of Contents iv...
Page 170: ...Publication DNET UM072C EN P July 2004 1 26 Get Started Notes...
Page 194: ...Publication DNET UM072C EN P July 2004 2 24 Identify Cable System Components Notes...
Page 212: ...Publication DNET UM072C EN P July 2004 3 18 Make Cable Connections Notes...
Page 238: ...Publication DNET UM072C EN P July 2004 4 26 Determine Power Requirements Notes...
Page 248: ...Publication DNET UM072C EN P July 2004 5 10 Correct and Prevent Network Problems Notes...
Page 250: ...Publication DNET UM072C EN P July 2004 A 2 Understand Select NEC Topics Notes...
Page 263: ......
Page 267: ...Isysnet Serial Bus System Selection Guide Pneumatic...
Page 287: ...H Series Fieldbus DeviceNet Adapters PSSCDM12A PSSCDM18PA User Manual...