UM10462
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2016. All rights reserved.
User manual
Rev. 5.5 — 21 December 2016
9 of 523
NXP Semiconductors
UM10462
Chapter 1: LPC11U3x/2x/1x Introductory information
LPC11U22FBD48/301
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
LPC11U23FBD48/301
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
LPC11U24FHI33/301
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 5
5
0.85 mm
n/a
LPC11U24FBD48/301
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
LPC11U24FET48/301
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
LPC11U24FHN33/401
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7
7
0.85 mm
n/a
LPC11U24FBD48/401
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
LPC11U24FBD64/401
LQFP64
plastic low profile quad flat package; 64 leads; body 10
10
1.4 mm SOT314-2
LPC11U34FHN33/311
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7
7
0.85 mm
n/a
LPC11U34FBD48/311
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
LPC11U34FHN33/421
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7
7
0.85 mm
n/a
LPC11U34FBD48/421
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
LPC11U35FHN33/401
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7
7
0.85 mm
n/a
LPC11U35FBD48/401
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
LPC11U35FBD64/401
LQFP64
plastic low profile quad flat package; 64 leads; body 10
10
1.4 mm SOT314-2
LPC11U35FHI33/501
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 5
5
0.85 mm
n/a
LPC11U35FET48/501
TFBGA48
plastic thin fine-pitch ball grid array package; 48 balls; body 4.5
4.5
0.7 mm
SOT1155-2
LPC11U36FBD48/401
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
LPC11U36FBD64/401
LQFP64
plastic low profile quad flat package; 64 leads; body 10
10
1.4 mm SOT314-2
LPC11U37FBD48/401
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
LPC11U37HFBD64/401
LQFP64
plastic low profile quad flat package; 64 leads; body 10
10
1.4 mm SOT314-2
LPC11U37FBD64/501
LQFP64
plastic low profile quad flat package; 64 leads; body 10
10
1.4 mm SOT314-2
Table 1.
Ordering information
…continued
Type number
Package
Name
Description
Version
Table 2.
Part ordering options
Part Number
FLASH
(kB)
SRAM
(kB)
(Main
SRAM)
SRAM1
(kB)
USB
SRAM
(kB)
Total
genera
purpose
SRAM
EEPROM
(kB)
USB I2C/
Fast+
SSP ADC
Chan
nels
GPIO
LPC11U12FHN33/201
16
4
-
2
6
N/A
1
1
2
8
26
LPC11U12FBD48/201
16
4
-
2
6
N/A
1
1
2
8
40
LPC11U13FBD48/201
24
4
-
2
6
N/A
1
1
2
8
40
LPC11U14FHI33/201
32
4
-
2
6
N/A
1
1
2
8
26
LPC11U14FHN33/201
32
4
-
2
6
N/A
1
1
2
8
26
LPC11U14FBD48/201
32
4
-
2
6
N/A
1
1
2
8
40
LPC11U14FET48/201
32
4
-
2
6
N/A
1
1
2
8
40
LPC11U22FBD48/301
16
6
-
2
8
1
1
1
2
8
40