TA600032-EN0/0
- 8 -
1.2.3.4
Precautions for mounting
C a u t i o n
⚫
Plastic packages absorb moisture easily. Even if they are stored indoors, they can absorb moisture as
time passes. If you put the LSI in a reflow oven leaving moisture absorbed, cracks may occur in the
resin or adhesion between the resin and the frame may deteriorate.
⚫
If you are worried about moisture absorption, dry the package thoroughly before reflowing the solder.
Dry the packages for 20 hours or more to 36 hours or less at 125 ± 5°C.
Can be dried up to twice.
⚫
Basically, if 30 days passes after opening the moisture proof bag, the LSI will need to be dried. When
soldering by a complete heating method such as infrared reflow, please work under the following
conditions. Reflow can be done up to twice.
The temperature profile of an infrared reflow furnace must be within the range shown in the figure below
(the temperatures shown are at the surface of the plastic package).
⚫
Dip soldering method can cause rapid temperature change in the package and may damage the LSI.
Therefore, do not use this method.
⚫
Hand soldering work using a soldering iron should be done under the following conditions:
Maximum temperature of the soldering iron at 350°C, maximum for 5 seconds, and twice or less.
Be careful that the soldering iron does not touch anywhere other than lead part, such as the package
body.
[Profile (compatible with lead-free soldering)]
200
255
P
a
ck
a
ge
b
o
dy
s
u
rf
ac
e
t
em
p
er
at
u
re
℃
260
220
Preheating
140 to 200
℃
60 to 120 seconds
Main heating
220
℃
or more
Within 60 seconds
255
℃
, within 10 seconds
Time s
140
