Reference Thermal Solution
40
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
3. To assemble the heatsink with the backplate, screw in the nuts with 8 in-lb.
6.5
Reliability Guidelines
The environmental reliability requirements for the reference thermal solution are
shown in
. These should be considered as general guidelines. Each
motherboard, heatsink and attach combination may vary the mechanical loading of the
component. Based on the end-user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume.
The testing will be performed with the sample board mounted on a test fixture. The test
profiles are unpacked board level.
Figure 6-5. Reference Thermal Solution Assembly Process - Heatsink Assembly (Step 2)
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
