Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
27
Thermal Metrology
15. Using a fine-point device such as a toothpick, place a small amount of Indium paste
flux on the Thermocouple bead. Refer to
Note:
Make sure you are careful to keep solder flux from spreading on the IHS surface or down the groove. It
should be contained to the bead area and only the tip (narrow section of the groove). This will keep the
solder from flowing onto the top of the device or down the groove to the insulation area.
16. Cut two small pieces of solder 1/16 inch (0.065 inch/ 1.5 mm) from the roll using
tweezers to hold the solder while cutting with a fine blade. Refer to
Figure 5-13. Measuring Resistance between Thermocouple and IHS
Figure 5-14. Adding a Small Amount of Past Flux to the Bead for Soldering
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
