Thermal Metrology
22
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Select a machine shop that is capable of holding drawing-specified tolerances. IHS
groove geometry is critical for repeatable placement of the thermocouple bead,
ensuring precise thermal measurements. A fixture plate should be used to machine the
IHS groove on the FCBGA7 Chipset Package on the Live Board. Refer to
5.1.4
Thermocouple Attach Procedure
In order to accomplish the thermocouple attach procedure, the following steps are
required:
1. Thermocouple conditioning and preparation
2. Thermocouple attach to the IHS
3. Soldering process
4. Cleaning and completion of the thermocouple installation
5.1.4.1
Thermocouple Conditioning and Preparation
1. Use a calibrated thermocouple, as specified in
.
2. Under a microscope verify the thermocouple insulation meets the quality
requirements. The insulation should be about 1/16 inch (0.062 ± 0.030) from the
end of the bead. Refer to
Figure 5-4. The Live Board on the Fixture Plate
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
