Packaging Technology
14
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
2. This is the maximum force that can be applied by a heatsink retention clip. The clip
must also provide the minimum specified load of 7.6 lbf on the package to ensure
TIM performance assuming even distribution of the load.
3. These specifications are based on limited testing for design characterization.
Loading limits are for the package only.
To ensure that the package static load limit is not exceeded, the designer should
understand the post reflow package height shown in
. The following figure
shows the nominal post-reflow package height assumed for calculation of a heatsink
clip preload of the reference design. Please refer to the package drawing in
to perform a detailed analysis.
§
Figure 2-5. Package Height
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
