Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
11
Packaging Technology
2
Packaging Technology
The Intel
®
3210 and 3200 Chipset consists of two individual components: the Memory
Controller Hub (MCH) and the Intel
®
I/O Controller (Intel
®
ICH9). The Intel
®
3210 and
3200 Chipset MCH component uses a 40 mm [1.57 in] x 40 mm [1.57 in] Flip Chip Ball
Grid Array (FC-BGA) package with an integrated heat spreader (IHS) and 1300 solder
balls. A mechanical drawing of the package is shown in
. For information on
the Intel
®
ICH9 package, refer to the Intel
®
I/O Controller Hub9 (ICH9) Thermal
Design Guidelines.
Figure 2-1. MCH Package Dimensions (Top View)
Figure 2-2. MCH Package Height
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
