Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
35
Reference Thermal Solution
6
Reference Thermal Solution
The design strategy of the reference thermal solution for the Intel
®
3210 and 3200
Chipset uses backing plate stiffness/design to show significant improvement in MB
strain and BGA forces. The thermal interface material and extrusion design
requirements are being evaluated for changes necessary to meet the Intel
®
3210 and
3200 Chipset thermal requirements. The Keep Out Zone (KOZ) will have the
requirements of heatsink mounting hole with Intel
®
3210 and 3200 Chipset. Refer to
and
for details. Other chipset components may or may not need
attached thermal solutions, depending on the specific system local-ambient operating
conditions. For information on the Intel
®
ICH9, refer to thermal specification in the
Intel
®
I/O Controller Hub9 (ICH9) Thermal Design Guidelines.
6.1
Operating Environment
The reference thermal solution will be designed assuming a maximum local-ambient
temperature of 55 °C. The minimum recommended airflow velocity through the cross-
section of the heatsink fins is 350 linear feet per minute (lfm) for 1U system and 450
linear feet per minute (lfm) for 2U+ system. The approaching airflow temperature is
assumed to be equal to the local-ambient temperature. The thermal designer must
carefully select the location to measure airflow to obtain an accurate estimate. These
local-ambient conditions are based on a 35 °C external-ambient temperature at sea
level. (External-ambient refers to the environment external to the system.)
6.2
Heatsink Performance
depicts the measured thermal performance of the reference thermal solution
versus approach air velocity. Since this data was measured at sea level, a correction
factor would be required to estimate thermal performance at other altitudes.
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
