Mechanical Drawings
48
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Figure B-3. Intel
®
3210 and 3200 Chipset Motherboard Component Back-Side Keep-Out
Restrictions
1
3
4
5
6
7
8
B
C
D
A
1
2
3
4
5
6
7
8
B
C
D
A
THIS DRAWING CONTAINS INTEL CORPORAT
ION CONFIDENTIAL INFORMATION. IT IS
DISCLOSED IN CONFIDENCE AND ITS CONT
ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI
SPLAYED OR MODIFIED, WITHOUT THE PRI
OR WRITTEN CONSENT OF INTEL CORPORAT
ION.
SHEET
2
OF
2
DO NOT SCALE DRAWING
SCALE:
1
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
CORP.
R
TMD
1
D94910
X
D
REV
DRAWING NUMBER
CAGE CODE
SIZE
DEPARTMENT
D94910
2
1
DWG. NO
SHT.
REV
81
3.1890
[]
60.6
2.3858
[]
38.05
1.4980
[]
19.05
.7500
[]
SECONDARY SIDE KEEPOUTS
NO COMPONENTS THIS AREA
COMPONENT CENTER
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
