Introduction
8
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
1.1
Design Flow
1.2
Definition of Terms
FC-BGA
Flip Chip Ball Grid Array. A package type defined by a plastic
substrate where a die is mounted using an underfill C4
(Controlled Collapse Chip Connection) attach style. The primary
electrical interface is an array of solder balls attached to the
substrate opposite the die. Note that the device arrives at the
customer with solder balls attached.
BLT
Bond line thickness. Final settled thickness of the thermal
interface material after installation of heatsink.
MCH
Memory controller hub. The chipset component contains the
processor interface, the memory interface, the PCI Express*
interface and the DMI interface.
ICH
I/O controller hub. The chipset component contains the MCH
interface, the SATA interface, the USB interface, the IDE
interface, the LPC interface, and so forth.
IHS
Integrated Heat Spreader. A thermally conductive lid integrated
into the package to improve heat transfer to a thermal solution
through heat spreading.
T
case_max
Maximum die or IHS temperature allowed. This temperature is
measured at the geometric center of the top of the package die
or IHS.
T
case_min
Minimum die or IHS temperature allowed. This temperature is
measured at the geometric center of the top of the package die
or IHS.
TDP
Thermal design power. Thermal solutions should be designed to
dissipate this target power level. TDP is not the maximum power
that the chipset can dissipate.
TIM
Thermal Interface Material. Thermally conductive material
installed between two surfaces to improve heat transfer and
reduce interface contact resistance.
T
LA
The local ambient air temperature at the component of interest.
The local ambient temperature should be measured just
Figure 1-1. Thermal Design Process
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T h e rm a l M o d e l
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T h e rm a l M o d e l U s e r's G u id e
S te p 1 : T h e rm a l
S im u la tio n
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T h e rm a l R e fe re n c e
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M e c h a n ic a l R e fe re n c e
S te p 2 : H e a ts in k S e le c tio n
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T h e rm a l T e s tin g S o ftw a re
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S o ftw a re U s e r's G u id e
S te p 3 : T h e rm a l V a lid a tio n
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Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
