Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
13
Packaging Technology
2.1
Non-Critical to Function Solder Joints
Intel has defined selected solder joints of the MCH as non-critical to function (NCTF)
when evaluating package solder joints post environmental testing. The MCH signals at
NCTF locations are typically redundant ground or no-critical reserved, so the loss of the
solder joint continuity at end of life conditions will not affect the overall product
functionality.
identifies the NCTF solder joints of the MCH package.
2.2
Package Mechanical Requirements
The Intel
®
3210 and 3200 Chipset package has an Integrated Heat Spreader (IHS)
which is capable of sustaining a maximum static normal load of 15-lbf. This mechanical
maximum load limit should not be exceeded during heatsink assembly, shipping
conditions, or standard use conditions. Also, any mechanical system or component
testing should not exceed the maximum limit. The package substrate should not be
used as a mechanical reference or load-bearing surface for the thermal and mechanical
solution.
Notes:
1. These specifications apply to uniform compressive loading in a direction normal to
the package.
Figure 2-4. Non-Critical to Function Solder Joints
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
