Thermal Metrology
30
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Note:
Do not touch the copper block at any time as it is hot.
23. Move a magnified lens light close to the device to get a better view when the solder
starts melting. Manually assist this if necessary as the solder sometimes tends to
move away from the end of the groove. Use fine tip tweezers to push solder into
the end of groove until a solder ball is built up. Refer to
.
Figure 5-18. Observing the Solder Melting
Figure 5-19. Pushing Solder Back into the End of Groove
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
