Thermal Metrology
28
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
17. Place the two pieces of solder in parallel, directly over the thermocouple bead.
18. Measure the resistance from the thermocouple end wires again using the DMM
(Refer to
step 3) to ensure that the bead is still properly contacting
the IHS.
5.1.4.3
Solder Process
19. Turn on the Solder Block station and heat it up to 170 °C±5 °C.
Note:
The heater block temperature must be set at a greater temperature to ensure that the
solder on the IHS can reach 150 °C - 155 °C. Make sure to monitor the Thermocouple
meter when waiting for solder to flow. Damage to the package may occur if a
temperature of 155 °C is exceeded on the IHS.
Figure 5-15. Cutting Solder
Figure 5-16. Positioning Solder on IHS
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
