Thermal Metrology
26
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
13. Place a second small piece of Kapton* tape on top of the IHS where it narrows at
the tip. This tape will create a solder dam and keep solder from flowing down the
IHS groove during the melting process. Refer to
14. Measure resistance from the Thermocouple connector (hold both wires to a DMM
probe) to the IHS surface, this should display the same value as read during
Thermocouple conditioning
step 3. This step insures the bead is still
making good contact to the IHS. Refer to
Figure 5-11. Placing Thermocouple Bead into the Bottom of the Groove
Figure 5-12. Second Tape Installation
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
