Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
21
Thermal Metrology
The orientation of the groove relative to the package pin 1 indicator (gold triangle in
one corner of the package) is shown in
for the FCBGA7 chipset package IHS.
Figure 5-2. FCBGA7 Chipset Package Reference Groove Drawing
Figure 5-3. IHS Groove on the FCBGA7 Chipset Package on the Live Board
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
