Thermal Metrology
24
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
8. Bend the wire at the edge of the IHS groove and secure it in place using Kapton*
tape. Refer to
9. Verify under the microscope that the Thermocouple bead is still slightly bent, if not,
use a fine point tweezers to put a slight bend on the tip. The purpose of this step is
to ensure that the Thermocouple tip is in contact with the bottom of groove. Refer
to
Figure 5-7. Extending Slightly the Exposed Wire over the End of Groove
Figure 5-8. Securing Thermocouple Wire with Kapton* Tape Prior to Attach
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
