Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
25
Thermal Metrology
10. Place the device under the microscope to continue with the process.
11. Using tweezers or a finger, slightly press the wire down inside the groove for about
5 mm from tip and place small piece of Kapton* tape to hold the wire inside the
groove. Refer to
12. Thermocouple bead is placed into the bottom of the groove (Refer to
and a small piece of tape is installed to secure it under the microscope to perform
this task.
Figure 5-9. Detailed Thermocouple Bead Placement
Figure 5-10. Tapes Installation
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
