Thermal Metrology
20
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Notes:
1.
The Special Modified Tip Solder Block Fixture is available from Test Equipment Depot 800-517-8431.
2.
The Alloy 57BI/42SN/1AG 0.010 Diameter solder and the solder flux are available from Indium Corp. of
America 315-853-4900.
3.
The Loctite* 498 Adhesive and Adhesive Accelerator are available from R.S. Hughes 916-737-7484.
4.
This part number is a custom part with the specified insulation trimming and packaging requirements
necessary for quality thermocouple attachment, See Figure 16. Order from Omega Eng +1-800-826-6342.
5.1.2
Thermal Calibration and Controls
It is recommended that full and routine calibration of temperature measurement
equipment be performed before attempting to perform case temperature
measurements. Intel recommends checking the meter probe set against know
standard. This should be done at 0 °C (using ice bath or other stable temperature
source) and at an elevated temperature, around 80 °C (using an appropriate
temperature source).
Wire gauge and length should also be considered, as some less expensive
measurement systems are heavily impacted by impedance. There are numerous
resources available throughout the industry to assist with implementation of proper
controls for thermal measurements.
Note:
1. It is recommended to follow company-standard procedures and wear safety items
like glasses for cutting the IHS and gloves for chemical handling.
2. Please ask your Intel field sales representative if you need assistance to groove
and/or install a thermocouple according to the reference process.
5.1.3
IHS Groove
Cut a groove in the package IHS according to the drawing given in
.
Calibration and Control
Ice Point Cell
Omega, stable 0°C temperature source
for calibration and offset
TRCIII
Hot Point Celll
Omega, temperature source to control
and understand meter slope gain
CL950-A-110
Table 5-1.
Thermocouple Attach Support Equipment (Sheet 2 of 2)
Item
Description
Part Number
Figure 5-1. Omega Thermocouple
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
