Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
41
Reference Thermal Solution
Notes:
1.
It is recommended that the above tests be performed on a sample size of at least twelve assemblies from
three lots of material.
2.
Additional pass/fail criteria may be added at the discretion of the user.
§
Table 6-2.
Reference Thermal Solution Environmental Reliability Guidelines
Test
(1)
Requirement
Pass/Fail Criteria
(2)
Mechanical Shock
3 drops for + and – directions in each of 3
perpendicular axes
Profile: 50 G, Trapezoidal waveform, 4.3 m/s [170
in/s] minimum velocity change
Visual Check and Electrical
Functional Test
Random Vibration
Duration: 10 min/axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
Power Spectral Density (PSD) Profile: 3.13 g RMS
Visual Check and Electrical
Functional Test
Temperature Life
85 °C, 2000 hours total, checkpoints at 168, 500,
1000, and 2000 hours
Visual Check
Thermal Cycling
-40 °C to +70 °C, 50 cycles
Visual Check
Summary of Contents for 3200
Page 6: ...6 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 10: ...Introduction 10 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 16: ...Thermal Specifications 16 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 18: ...Thermal Simulation 18 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
Page 42: ...Reference Thermal Solution 42 Intel 3210 and 3200 Chipset Thermal Mechanical Design Guide ...
