your position is our focus
5.3 Processing
5.3.1 Moisture
Preconditioning
Both
encapsulant
and
substrate
materials
absorb
moisture.
JEDEC
specification
J-STD-020
must
be
observed
to
l
requirements
after
opening
the
seal
is
opened
has
been
exceeded,
e.g.
exposure
e
Rec
m
Dur
Temperature:
125°C
Humidity:
Below
5%.
Desiccant
must
be
placed
into
the
oven
to
keep
humidity
low.
Oven:
Convection
flow
oven.
Also
put
desiccant
pack
into
the
oven
for
dehydration.
After
work:
Put
the
baked
components
with
desiccant
and
moisture
indicator
into
a
humidity
proof
bag
and
use
a
vacuum
hot
barrier
sealing
machine
for
sealing
if
not
processed
within
specified
floor
time.
Storage
in
a
nitrogen
cabinet
or
dry
box
is
also
a
possible
approach
to
prevent
moisture
intake.
!
Warning
Do
not
attempt
to
bake
the
ANTARIS
®
4
GPS
Modules
contained
in
tape
and
rolled
up
in
reels.
If
you
need
to
bake
the
ANTARIS
®
4
GPS
Modules
quickly
at
125°C
for
48
hours,
remove
them
from
the
belt
and
place
them
individually
onto
the
oven
tray.
Note
A
repeated
baking
process
will
reduce
the
wetting
effectiveness
of
the
pad
contacts.
This
applies
to
all
SMT
devices.
5.3.2 Soldering
Paste
prevent
cracking
and
delamination
associated
with
the
"popcorn"
effect
during
solder
reflow.
The
popcorn
effect
can
be
described
as
miniature
explosions
of
evaporating
moisture.
Baking
before
processing
is
required
in
following
cases:
•
Humidity
indicator
card:
At
least
one
circular
indicator
is
no
longer
blue
•
Floor
life
or
environmenta
to xcessive
seasonal
humidity.
om ended baking procedure:
ation:
48
hours
Use
of
"No
Clean"
soldering
paste
is
strongly
recommended,
as
it
does
not
require
cleaning
after
the
soldering
process
has
taken
place.
The
paste
listed
in
the
example
below
meets
these
criteria.
Ltd.)
Stencil
Thickness:
150
µm
for
base
boards
ds
on
the
approved
manufacturing
procedures.
The
t
mendations
in
section
3.6.2
.
Note
on
the
connectors
(’half
vias’)
should
meet
the
appropriate
IPC
specification.
Soldering
Paste:
LFSOLDER
TLF-206-93F
(Tamura
Kaken
(UK)
Alloy
specification:
Sn
95.5/
Ag
3.9/
Cu
0.6
(95.5%
Zinc/
0.6
%
Silver/
0.6%
Copper)
Melting
Temperature:
216
-
221°C
The
final
choice
of
the
soldering
paste
depen
pas e-mask
geometry
for
applying
soldering
paste
should
meet
the
recom
The
quality
of
the
solder
joints
GPS
Modules
-
System
Integration
Manual
(SIM)
(incl.
Reference
Design)
Product
Handling
GPS.G4-MS4-05007-A1
Page 128
