u-blox ANTARIS 4, Руководство по системной интеграции

Страница: 130 / 187

your position is our focus
Preheat
0
50 100 150 200 250 300
50
100
150
200
250
Heating Cooling
[°C]
100
150
200
250
Peak Temp.
230 - 250 °C
Liquidus Te
max 1- 4 °C/s
max 60 - 120 s
mperature
116 - 221
Elapsed Time [s]
max 20 - 40 s
Typical Leadfree
Soldering Profile
End Temp.
150 - 200 °C
Typical Leaded
Soldering Profile
50
max 3 °C/s
[°C]
) modules in a leaded process , check the following
andard leads process
d w
to check whether:
•
All pads are properly soldered
•
No excess solder has created contacts to neighboring pads, or possibly to pad stacks and vias nearby.
Figure 102: Recommended soldering profile
Note When soldering leadfree (ANTARIS
®
4
temperatures:
•
PB- Technology Soaktime: 40-80sec
•
Time above Liquidus: 40-90 sec
•
Peak temperature: 225-235 °C
These Peak temperatures is around 10 degree igher than the recomme h nded st
®
on ANTARIS products.
re . Note The ANTARIS
®
modules must not be solde ith a damp heat process
5.3.4 Optical Inspection
After soldering the ANTARIS 4 GPS Module, consider an optical inspection
®
step
•
ANTARIS
®
4 GPS Module is properly aligned and centered over the pads
GPS Modules - System Integration Manual (SIM) (incl. Reference Design) Product Handling
GPS.G4-MS4-05007-A1 Page 130