Themis RES-11XR3, Руководство по установке

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RES-11XR3 Installation Manual
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Themis Computer
The 1RU-high (1.75”) RES-11XR3 has been designed to fit into a standard 19” rack
and is provided with rack-mount brackets with handles.
Optional rack-mount slides
are also available. The RES-11XR3 is rugged enough to withstand extreme shock
(up to 35G), temperature, and EMI associated with such demanding markets as the
military, aerospace, and telecommunications industries.
The single quad/dual-core Intel Xeon CPU operates up to 6.4 GT/s (with a 1333-
MHz front-side system bus) and supports up to 24 GB of DDR3 ECC DIMM mem-
ory modules. The RES-11XR3 is based on the functionality and capability of the fol-
lowing Intel chipset:
• Intel X58 Express chipset
• ICH1OR
An overview of RES-11XR3 design and specifications is given in Chapter 1, "Over-
view and Specifications", of this manual.
Table 3. Front I/O 16” Chassis Manual Matrix (AC and DC Power Supplies)
Mother-
board
CPU
Soc
kets
RES-32XR3/FIO Manual P/N RES-22XR3/FIO Manual P/N
X8DAH+-F * 2 117611-024
X8DTU-F 2 117664-024
Naming Key: X8 uvwxyz
z
System RES- x 2XR3S and RES- x 1XR3, where
x = 3, 2, or 1
*RES-32XR3/FIO motherboard X8DAH+-F supports both audio and video;
however, the naming key does not contain a “T” in the title.
u: D = Double CPU sockets
S = Single CPU socket
v: A = Sound chip; no graphics chip
T = Graphics chip; no sound chip
w: Not applicable
x: i = SATA only
3 = SAS 1.0
6 = SAS 2.0
y: LN4 = Extra gigabit Ethernet controller for two extra ports
z: F = IPMI
blank = No IPMI