![Texas Instruments TMS320TCI6482 Скачать руководство пользователя страница 5](http://html.mh-extra.com/html/texas-instruments/tms320tci6482/tms320tci6482_design-manual_1094767005.webp)
www.ti.com
3
Device Identification (ID)
4
Pin and Package Compatibility
Device Identification (ID)
Table 1. TCI6482 Features, Comparison to TCI100 Processor (continued)
JTAG BSDL_ID
JTAGID register
Read value: 0x0008A02F
JTAGID register
Read value: 0x008102F
Frequency
Core clock
Up to 1-GHz
Core clock
720MHz,
850MHz
Voltage
Core Supply
1.2V
Core Supply
1.2V
IO Supplies
3.3V, 1.8V (1.5), 1.2V
IO Supply
3.3V
PLL and PLL
PLL1 for Core Clock
PLL for Core Clock
controller Options
(Software
(Hardware
configurable)
configurable)
PLL2 for DDR/EMAC
Clock
BGA Package
697-Pin BGA
ZTZ Suffix
532-Pin BGA
GLZ Suffix
Package, 0.8mm
Package, 0.8mm
pitch, 24mmx24mm
pitch, 23x23mm
Process Technology
0.09um/7-Level Cu
0.09um/7-Level Cu
Metal Process
Metal Process
(CMOS)
(CMOS)
Device Part Numbers
TMX320TCI6482ZTZ
TMS320TCI100GLZ
The JTAG (BSDL) ID and Silicon Revision ID are different than other TMS320C64x DSP devices. The
TCI6482 device IDs are shown in the table below and are referred to as JTAG (BSDL) IDs. The JTAG
(BSDL) ID is accessible via JTAG on both devices and through the JTAG ID register at address
0x02A80008 on the TCI6482 device.
Table 2
identifies the JTAG (BSDL) ID differences between the TCI100 and TCI6482.
Table 2. TCI6482 and TCI100 JTAG (BSDL) IDs
JTAG (BSDL) ID
Device
Variant [31:28]
Part Number [27:12]
Manufacturer [11:1]
LSB
TCI6482
xxxxb
(1)
0000000010001010b
00000010111b
1 [0]
TCI100
xxxxb
(2)
0000000010000001b
00000010111b
1
(1)
Variant field indicates the silicon version. Refer to the data manual and errata for current silicon versions.
(2)
Variant field indicates the silicon version. Refer to the data manual and errata for current silicon versions.
The TCI6482 does not have a Silicon Revision ID as found in the TCI100.
The physical dimensions and pin out of package used for TCI6482 will be different from TCI100.
Modification will be needed to account for the different physical dimensions of package and pin out.
Changes in substrate may also affect the thermal characteristics of the package used for TCI6482. See
the TMS320TCI6482 Communications Infrastructure Digital Signal Processor (SPRS246) for additional
information regarding package characteristics.
SPRAAC7B – April 2006
TMS320TCI6482 Design Guide and Migration from TMS320TCI100
5
Submit Documentation Feedback