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VDDMON
VDD
VSS
100 ohms
0 ohms
+SENSE
VSS
-SENSE
VOUT
Routed as a signal
Routed as a signal
REGULATOR
TCI6482
VDD
VDD
VSS
VSS
VDD and VSS
routed as planes
7.5.2
Voltage Plane IR Drop
7.6
Power-Supply Decoupling and Bulk Capacitors
Power Supply
Figure 11. Single DSP Remote Sense Connections
The voltage gradient (IR drop) needs to be considered whether or not a supply with the remote sense
capability is used. The DSPs closer to the supply will have a slightly higher voltage and the DSPs farther
from the supply will have a slightly lower voltage. This voltage differential can be minimized by making the
copper planes thicker or by spacing the DSPs across a wider area of the plane. Be sure to consider both
the core power plane(s) and the ground plane(s). The resistance of the plane can be determined by the
following formula:
R = rho * length / (width * thickness)
where rho is the resistivity of copper equal to 1.72E-8 ohm-meters. PCB layer thickness is normally stated
in “ounces”. One ounce of copper is about 0.012 inches or 30.5E-6 meters thick. The width must be
derated to account for vias and other obstructions. A 50mm wide strip of 1oz copper plane derated 50%
for vias will have a resistance of 0.57mohms per inch.
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as
possible close to the DSP. Assuming 0402 caps, the user should be able to fit the number of capacitors
given in
Table 9
. These caps need to be close to the DSP, no more than 1.25 cm maximum distance to be
effective. Ideally, these caps should be connected directly to the via attached to the BGA power pin.
Parasitic inductance limits the effectiveness of the decoupling capacitors; therefore the physically smaller
0402 capacitors are recommended. As with selection of any component, verification of capacitor
availability over the product’s production lifetime should be considered.
Proper capacitance values are also important. Small bypass caps (near 560 pF) should be placed closest
to the power pins. Medium bypass caps (100 nF or as large as can be obtained in a small package)
should be the next closest. TI recommends placing decoupling capacitors immediately next to the BGA
vias, using the “interior” BGA space and at least the corners of the “exterior”. The inductance of the via
connect can eliminate the effectiveness of the capacitor so proper via connections are important. Trace
length from the pad to the via should be no more than 10 mils and the width of the trace should be the
same width as the pad.
Larger caps can be placed further away for bulk decoupling. Large bulk caps should be furthest away (but
still as close as possible).
SPRAAC7B – April 2006
TMS320TCI6482 Design Guide and Migration from TMS320TCI100
19
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