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9.10.2
System Implementation of I
2
C
9.11 Ethernet Media Access Controller
9.11.1
Configuration of EMAC, MII, and MDIO
9.11.2
System Implementation of MII
9.11.2.1
RMII Implementation
Peripheral Section
External pull-up resistors to 3.3V are needed on the I²C signals (SCL, SDA). The recommended pull-up
value is 4.7K ohms.
Multiple I²C devices can be connected to the interface but the speed may need to be reduced (400KHz is
the maximum) if many devices are connected.
Documentation for Ethernet Media Access Controller (EMAC):
•
TMS320TCI648x DSP EMAC/MDIO Module Reference Guide (SPRUE12)
•
TCI6482 System Boot
•
TCI6482 IBIS Model File
•
Using IBIS Modes for Timing Analysis (
SPRA839
)
The EMAC interface MII/RMII/GMII signals are multiplexed with the Utopia interface, so only RGMII is
available if the Utopia interface is also used. When EMAC is enabled, the MDIO interface is always
enabled. Two other strapping bits are used to select the MII mode (MII, GMII, RMII, RGMII). The MII, GMII
and RMII share interface pins. The RGMII uses HSTL buffers and therefore has its own interface. There
are 2 sets of MDIO interfaces (LVCMOS and HSTL). If MII, GMII or RMII are selected the LVCMOS MDIO
interface (MDCLK, MDIO) is used. If RGMII is selected the HSTL MDIO interface (RGMDCLK, RGMDIO)
is used.
Even if EMAC is enabled by boot strapping, it still must be enabled via software before it can be
accessed.
The EMAC RMII , GMII, and RGMII require specific clock frequencies from PLL2 and therefore require
that CLKIN2 be 25MHz. In silicon version 2.0 and beyond RMII will no longer use the PLL2 output. MII
mode does not use the PLL2 output.
The RGMII interface HSTL buffers can either be operated at 1.5V or 1.8V. This is done by powering the
DVDD15 at either 1.5V or 1.8V. Operation at either of these voltages uses the same AC timings. 1.8V
operation consumes slightly more power than 1.5V but eliminates the need for creation of a separate 1.5V
supply. VREFHSTL is generated using a resistor divider from DVDD15 and therefore scales correctly.
In RGMII mode, the MDIO signals run at the same HSTL voltage as the RGMII signals.
For LVCMOS EMAC signals that are not used, these can either be left floating or pulled high. If left
floating some additional power is drawn due to leakage through the I/O buffers. If RGMII is not used, the
RGMII specific power planes should be connected to GND:
•
VREFHSTL, DVDD15, RSV07, RSV08, RSV14. If RGMII power planes are connected to GND all
RGMII signals (including RGMDIO and RGMDCLK) should be no-connects.
CLKIN2 should not be left floating and should be pulled to GND if not needed.
For termination, follow the switch/ PHY recommendations. If none are provided, it is recommended to use
series resistance termination. Typical values of 22 ohms or 33 ohms are normally adequate but IBIS
simulations can be used to verify the best value with a specific board implementation. All MII connections
should be point-to-point only.
In silicon version 1.1 the RMII interface supplies the 50MHz RMII reference clock as an output. This needs
to be connected to the reference clock input of the connected RMII device. There is no guaranteed timing
relationship between the CLKIN2 25MHz clock and this RMII reference clock. Therefore it cannot be
assumed that aligning CLKIN2 to multiple TCI6482 devices results in aligned RMII interfaces.
SPRAAC7B – April 2006
TMS320TCI6482 Design Guide and Migration from TMS320TCI100
33
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