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Appendix B: System Specifications
Appendix B
System Specifications
Processors
3rd Generation Intel® Xeon® Scalable processorss in an LGA4189 socket; UPI up to 10.4GT/s; supports CPU TDP up to
205W
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel® C621
BIOS
AMI 128Mb SPI Flash EEPROM
Memory
48 DIMM slots for up to 12TB 3DS ECC DDR4-3200:RDIMM/LRDIMM or 18TB Intel® Optane™ DDR4-2666:DCPMM, RDIMM/
LRDIMM//DCPMM
Storage Drives
24 hot-swap 2.5" NVMe/SAS3/SATA3 drive bays
Four optional rear 2.5” bays SAS/SATA
Two M.2 NVMe/SATA3
PCI Expansion Slots
Up to 6 single-wide PCIe 3.0 (4 x16 + 2 x8) slots
-or-
Up to 2 double-wide PCIe 3.0 x16 slots for GPUs
Input/Output
Network: Two 10G BaseT with Intel X710-TM4; 2x 10G SFP+ with Intel X710-TM4, and (optional) AIOM up to 100G QSFP 28
BMC: Dedicated LAN port
USB: Two rear USB 3.0 ports, one USB 3.0 Type A header
Video : One VGA port
COM: One serial port header
Motherboard
-P; Length 17.0", width 16.8" (431.8 mm x 426.7 mm)
Chassis
CSE-218HTS-R2K08P; 2U Rackmount, 3.5 x 17.3 x 31.6in. / 89 x 439.5 x 803mm (HxWxD)
System Cooling
Four 8-cm heavy duty fans