Sun Microsystems 817-4054-15, Руководство по обслуживанию

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Chapter 9 CPU/Memory Boards 9-3
9.2 CPU/Memory Boards
The CPU/Memory boards (SB0, SB2, and SB4) are removed and replaced from the
top of the system (
FIGURE 9-2
). When you remove a CPU/Memory board from the
system, place it in its ESD safe packaging box. The CPU/Memory board box
provides two ESD safe work surfaces.
Each CPU/Memory board can support:
■
Up to four CPU processors
■
Up to 32 DIMMs (dual inline memory modules)
■
Up to eight Ecache modules
Each CPU processor can support:
■
Two DIMM banks (four DIMMs per bank)
■
Up to eight Gbytes of memory
■
Two Ecache modules
The memory controller is integrated in the CPU processor. The CPU/Memory board
has a metal cover that covers the CPU processors and Ecache.
FIGURE 9-2
Top View of the CPU/Memory Boards
SB0
SB2
SB4
Front
Rear