Rigaku MFM65S2RFFFLFL, Инструкция по эксплуатации

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ME12058B
Operation Section
1. OVERVIEW
This manual is described the operation of MFM65 system (RFBFLFL Model).
This equipment can measure the thickness, density, and roughness of the surface and boundary of thin
films deposited on a wafer (max. of 12 inches (300 mm), or 8 inches).
This is a complex equipment that can estimate a crystalline by the X-ray diffraction (
XRD
), and the
compositions of multi-layer films by the X-ray fluorescence (
XRF
), in addition to measuring film
thickness by the X-ray reflectometry (
XRR
).
This equipment can be used in clean rooms, and meets a wide array of needs ranging from condition
estimation for semiconductor films (R&D) to process monitoring.
NOTE : In the case of modifying the MFM65 system without consulting RIGAKU, the system
may not satisfy the specifications of this system, and RIGAKU does not warrant the
system.
RIGAKU may change the specifications of the MFM65 system and the contents of the
printed materials including the manual without notice in the future.