Rigaku MFM65S2RFFFLFL, Инструкция по эксплуатации

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ME12058B
Operation Section
Goniometer
Type
Theta-Theta goniometer ----- Horizontal Sample Placement
θ
s axis (X-ray tube mounted)
– 3 to 60 degrees 0.001 degree/step
θ
d axis (Detector mounted)
– 3 to 60 degrees 0.001 degree/step
θ
s/
θ
d (2
θ
/
θ
)coupled scan
Scanning range – 10 to 120 degrees, 0.002 degree/step
Scanning mode
Independent
θ
s or
θ
d scan
Radial scan
θ
s =
θ
d
Rocking scan -
θ
s =
θ
d
Sample Stage
Sample holder
For 300 mm and 200 mm wafers
Sample chuck
Vacuum chuck at edge exclusion area on the backside of wafer
φ
axis (in-plane rotation)
0 to 360 degrees 0.2 degree/step
Z axis (up / down)
-13 to 1 mm 0.000156 mm/step
Sub
φ
axis (in-plane rotation)
±
5 degrees 0.0001 degree/step
X axis (left / right)
0 to 150 mm 0.0002 mm/step
Y axis (front / back)
-150 to 150 mm 0.0002 mm/step
Pattern Recognition Unit
Positioning accuracy
X : ±2 µm ( σ ), Y : ±1 µm ( σ ), Z : ±1 µm ( σ )
Imaging unit
Lens magnification : ×5, CCD camera (monochrome)
Auto focusing unit
Lens magnification : ×5
AF-Z axis (up / down)
0 to 4 mm 0.0001 mm/step (For auto focus lens)
DT-Z axis (up / down)
0 to 40 mm 0.002 mm/step (For SDD)
EFEM
Load port
2 load ports (model TAS300) manufactured by TDK
FOUP for 300 mm wafers
Adapter for 200 mm wafers in the FOUP
Wafer transfer robot
For 300 mm and 200 mm wafers
Wafer aligner
For 300 mm and 200 mm wafers
PC system
PC main body
IBM PC Compatible (OS : WindowsXP)
Display
LCD
Keyboard
Compact type
Track ball
Optical type
Joy stick
For pattern recognition