Ossila Slot-Die Coater
User Manual
Ossila.com
32
Ossila Limited © 2019
a time until the substrate is free to
move.
•
Repeat for the back of the substrate.
Return to the front of the substrate
and zero the digital height gauges.
2.
Set the gap height. Slowly raise the slot-
die head using the micrometers,
alternating between them in small steps,
until the height gauges show the required
gap (see
Section 10.1
).
9.2.9
Forming a meniscus
Before coating, a meniscus of solution should
be formed across the width of the substrate by
dispensing a small amount of solution in the
Manual Mode
. The slowest dispense rate
should be used to avoid dispensing too much
solution onto the substrate, which can cause
defects. Solution should be pumped until a
small amount comes out of the head and forms
a meniscus on the substrate surface.
Alternatively, a program step can be used to
perform this automatically.
9.2.10
Running a Program
WARNING: Pinch points and entanglement
The rotation of the lead screw/coupling and the movement of the plunger pusher
present entanglement and pinch hazards. Care should be taken when the system is
running.