DRAFT
DRAFT DRAFT DR
DRAFT DRAFT DRAFT
D
RAF
DRAFT DRAFT DRA
FT D
RAFT DR
AFT D
DRA
FT DRAFT DRAFT
D
RAFT
DRAFT
D
RAFT
DRA
UM10601
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Preliminary user manual
Rev. 1.0 — 7 November 2012
5 of 313
NXP Semiconductors
UM10601
Chapter 1: LPC800 Introductory information
1.3 Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC810M021FN8
DIP8
plastic dual in-line package; 8 leads (300 mil)
SOT097-2
LPC811M001FDH16
TSSOP16
plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
LPC812M101FDH16
TSSOP16
plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
LPC812M101FD20
SO20
plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
LPC812M101FDH20
TSSOP20
plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
Table 2.
Ordering options
Type number
Flash/kB SRAM/kB USART
I
2
C
SPI
Comparator
GPIO
Package
LPC810M021FN8
4
1
2
1
1
1
6
DIP8
LPC811M001FDH16
8
2
2
1
1
1
14
TSSOP16
LPC812M101FDH16
16
4
3
1
2
1
14
TSSOP16
LPC812M101FD20
16
4
2
1
1
1
18
SO20
LPC812M101FDH20
16
4
3
1
2
1
18
TSSOP20