263
APPENDIX A DEVELOPMENT TOOLS
User’s Manual U15104EJ2V0UD
Figure A-3. EV-9200GC-80 Recommended Board Mounting Pattern (for Reference Only)
A
F
D
E
C
B
G
J
K
L
H
I
0.026
×
0.748=0.486
0.026
×
0.748=0.486
EV-9200GC-80-P1E
ITEM
MILLIMETERS
INCHES
A
B
C
D
E
F
G
H
I
J
K
L
19.7
15.0
15.0
19.7
6.0
±
0.05
6.0
±
0.05
0.35
±
0.02
2.36
±
0.03
2.3
1.57
±
0.03
0.776
0.591
0.591
0.776
0.236
0.236
0.014
0.093
0.091
0.062
0.65
±
0.02
×
19=12.35
±
0.05
0.65
±
0.02
×
19=12.35
±
0.05
φ
φ
+0.001
–0.002
+0.003
–0.002
+0.001
–0.002
+0.003
–0.002
+0.003
–0.002
+0.003
–0.002
+0.001
–0.001
+0.001
–0.002
φ
+0.001
–0.002
φ
φ
Dimensions of mount pad for EV-9200 and that for target
device (QFP) may be different in some parts. For the
recommended mount pad dimensions for QFP, refer to
"SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL" (C10535E).
Caution
φ
Содержание mPD178053
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