Intel Pentium III Processor 512K, Руководство по конструкции

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LV Intel
®
Pentium
®
III Processor 512K Dual Processor Platform
Design Guide 11
Table 2. Micro-FCBGA Package Mechanical Specifications
Symbol Parameter Min Max Unit
A Overall height, as delivered (1) 2.27 2.77 mm
A2 Die height 0.854 mm
b Ball diameter 0.78 mm
D Package substrate length 34.9 35.1 mm
E Package substrate width 34.9 35.1 mm
D1 Die length 11.18 mm
E1 Die width 7.19 mm
e Ball pitch 1.27 mm
N Ball count 479 each
K Keep-out outline from edge of package 5 mm
K1 Keep-out outline at corner of package 7 mm
K2 Capacitor keep-out height — 0.7 mm
S Package edge to first ball center 1.625 mm
-- Solder ball coplanarity 0.2 mm
Pdie Allowable pressure on the die for thermal solution — 689 kPa
W Package weight 4.5 g
NOTES:
1. All dimensions are subject to change.
2. Overall height as delivered. Values were based on design specifications and tolerances. Final height after
surface mount depends on OEM motherboard design and SMT process.