Infineon PG-TO220, Руководство пользователя

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Additional information 2 of 31 Revision 4.0
2021-10-11
Recommendations for board assembly of Infineon transistor outline
type packages
Table of contents
Table of contents
Table of contents ............................................................................................................................ 2
Acronyms and abbreviations ............................................................................................................ 3
1 Package description ............................................................................................................... 4
1.1 TO SMD package type.............................................................................................................................. 4
1.2 TO THD package type .............................................................................................................................. 5
1.3 HSOG package type ................................................................................................................................. 6
1.4 Package features and general handling guidelines ............................................................................... 6
2 Printed circuit board ............................................................................................................. 10
2.1 Routing .................................................................................................................................................. 10
2.2 Pad design ............................................................................................................................................. 10
2.3 Via-in-pad design ................................................................................................................................... 11
3 Mounting of surface-mount devices ........................................................................................ 13
3.1 Solder paste stencil ............................................................................................................................... 13
3.2 Solder paste ........................................................................................................................................... 13
3.3 Component placement of SMD ............................................................................................................. 14
3.4 Reflow soldering .................................................................................................................................... 14
3.5 Wave soldering of SMD .......................................................................................................................... 15
4 Mounting of through-hole devices ........................................................................................... 16
4.1 Pre-mounting processes and mounting materials .............................................................................. 16
4.2 Component placement of THD ............................................................................................................. 19
4.3 Heat sink mounting ............................................................................................................................... 19
4.4 Soldering of THD ................................................................................................................................... 23
4.5 Alternative mounting methods ............................................................................................................. 24
5 Cleaning ............................................................................................................................... 25
6 Inspection ............................................................................................................................ 26
6.1 Optical solder joint inspection .............................................................................................................. 26
6.2 X-ray solder joint inspection ................................................................................................................. 27
7 Rework ................................................................................................................................ 28
8 References ........................................................................................................................... 29
Revision history............................................................................................................................. 30