Infineon PG-TO220, Руководство пользователя

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Additional information 6 of 31 Revision 4.0
2021-10-11
Recommendations for board assembly of Infineon transistor outline
type packages
Package description
1.3 HSOG package type
Infineon heatsink small outline gullwing (HSOG) packages present a space optimized version of the TO263
(D2PAK) and are also called TO-Leaded with gullwing (TOLG). The tab thickness is reduced to decrease the
junction to case thermal resistance while the height shrink increases the power density. The gullwing lead
shape is preserved in contrast to leadless TO solutions in order to achieve high performance during
temperature cycling on board (TCoB).
Figure 3 shows a HSOG package.

PG-HSOG
PG = plastic green
H = heatsink
SO = small outline
G = gullwing
Figure 3 Example of surface-mount HSOG package.
1.4 Package features and general handling guidelines
General handling guidelines
Semiconductor devices are sensitive to excessive electrostatic discharge (ESD), moisture, mechanical handling,
and contamination. Therefore, they require specific precautionary measures to ensure that they are not
damaged during transport, storage, handling, and processing.
For further information about component handling, please refer to the General Recommendations for Board
Assembly of Infineon Packages document that is available on the Infineon web page [1]. Please also feel free to
contact your local sales, application, or quality engineer.
Internal construction
The components of the TO SMD and HSOG package families feature plastic-encapsulated chips on a copper
leadframe using single-ended perimeter leads. An example of the inner setup of TO SMD or HSOG packages is
shown in
Figure 4 .
The TO THD components provide long strait leads for through-hole insertion. Large heat sink pads can protrude
the mold body outline or can terminate within it. An example of the inner setup of TO THT packages is shown in
Figure 5 .