Infineon PG-TO220, Руководство пользователя

Страница: 29 / 31

Additional information 29 of 31 Revision 4.0
2021-10-11
Recommendations for board assembly of Infineon transistor outline
type packages
References
8 References
[1] Infineon: Packages. https://www.infineon.com/packages .
[2] Infineon: Thermal performance of surface mount semiconductor packages. AN_201708_PL52_023, V 1.0,
2018-03-07.
https://www.infineon.com .
[3] International Electrotechnical Commission: IEC 60068-2-58. Environmental testing – Part 2-58: Tests –
Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of
surface mounting devices (SMD).
[4] Electronic Components Industry Association, Assembly and Joining Processes and JEDEC Solid State
Technology Association Committee: EIA/IPC/JEDEC J-STD-002. Solderability Tests for Component Leads,
Terminations, Lugs, Terminals and Wires.
[5] JEDEC Solid State Technology Association: IPC/JEDEC J-STD-020. Moisture/Reflow Sensitivity
Classification for Nonhermetic Surface Mount Devices.
[6] JEDEC Solid State Technology Association: IPC/JEDEC J-STD-033. Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices.
[7] Association Connecting Electronics Industries: IPC-A-610. Acceptability of Electronic Assemblies.
[8] JEDEC Solid State Technology Association: JESD22-B106. Resistance to Solder Shock for Through-Hole
Mounted Devices.
[9] International Electrotechnical Commission: IEC 60068-2-20. Environmental testing – Part 2-20: Tests –
Test T: Test methods for solderability and resistance to soldering heat of devices with leads