Additional information
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Revision 4.0
2021-10-11
Recommendations for board assembly of Infineon transistor outline
type packages
Cleaning
5
Cleaning
After the soldering process, some flux residues may remain on the board, especially near the solder joints.
Generally, cleaning beneath a SMD component is difficult due to the small gap between the component body
and the PCB. Therefore, a “no-clean” flux is recommended whose residues usually do not have to be removed
after the soldering process.
In case the solder joints have to be cleaned, the cleaning method (e.g. ultrasonic, spray, or vapor cleaning) and
cleaning solution have to be selected while taking into account the type of package, the flux used in the solder
paste (rosin/resin-based, water-soluble, etc.) as well as the environmental and safety aspects. Even small
residues of the cleaning solution should be removed or dried out very thoroughly.
For recommended cleaning solutions, please contact the solder paste or flux manufacturer.
