Additional information
7 of 31
Revision 4.0
2021-10-11
Recommendations for board assembly of Infineon transistor outline
type packages
Package description
Figure 4
Schematic showing the inner setup of a TO SMD package.
Figure 5
Schematic showing the inner setup of a TO THT package.
Thermal performance
The overall thermal performance of a package with a heat sink is characterized by a junction-to-ambient
thermal resistance R
thja
. The R
thja
can be calculated as shown in
Equation 1
.
Figure 6
Thermal model of a TO package on a heatsink.
