Infineon PG-TO220, Руководство пользователя

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Additional information 21 of 31 Revision 4.0
2021-10-11
Recommendations for board assembly of Infineon transistor outline
type packages
Mounting of through-hole devices
resistance. Hence, an appropriate range of mounting torque values must be used to ensure minimal thermal
resistance. This prevents package destruction or changes in thermal and electrical device characteristics.
Figure 14 Example of a heat sink assembly with screw mounting.
Improper mounting can damage a die. Molding compound can delaminate due to external mechanical stress,
e.g. mounting on warped heat sink a shown in
Figure 15 .
Figure 15 C-scanning acoustic microscopy (CSAM) image showing the delamination of molding
compound to die paddle interface at the package head (TO220).
A maximum torque used for heat sink mounting of 1.0 Nm is recommended. Higher mounting torque does not
directly result in lower R
th
values as can be seen in the graph from Figure 16 but may at the worst cause
package damage depending on the insulation material used.