Additional information
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Revision 4.0
2021-10-11
Recommendations for board assembly of Infineon transistor outline
type packages
Package description
1
Package description
This document provides information about the board assembly of Infineon transistor outline (TO) and heatsink
small outline gullwing (HSOG) packages by surface mount technology (SMT) and through-hole technology
(THT). TO packages are available as surface-mount devices (SMD) and through-hole devices (THD).
The I/O leads of the single-ended SMD packages are bent outwards from the package mold body side forming a
distinct “foot” and “heel” geometry. That “gullwing” shaped lead geometry can be mounted on the same board
surface together with the heat sink pad using fully automated processes.
The leads of THD are inserted in drilled holes of the board prior to soldering. Depending on the specific process
and technology, this may require certain pre-mount processing steps. The heat sink of THD package can either
be mounted on the board or can be equipped with an additional heatspreader.
The packages are optimized for silicon (Si) and silicon carbide (SiC) metal-oxide-semiconductor field-effect
transistor (MOSFET), insulated-gate bipolar transistor (IGBT), and Schottky diode devices for automotive and
industrial power applications and provide a high heat dissipation.
This document does not discuss dual small outline (DSO) or heatspreader dual small outline package (HDSOP)
from so called transistor outline leaded top-side cooling (TOLT) package family. These package families are
described in separate documents.
1.1
TO SMD package type
Infineon TO SMD packages are available as DPAK and D2PAK with with a mold body size of approx. 6 to 9 mm.
Infineon designations are following the standardized names TO-252 and TO-263 as given by JEDEC.
shows examples of the TO SMD package family.
PG-TO252 DPAK
PG-TO263 D2PAK
PG = plastic green
TO = transistor outline
Figure 1
Examples of surface-mount TO packages.
