Infineon PG-TO220, Руководство пользователя

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Additional information 3 of 31 Revision 4.0
2021-10-11
Recommendations for board assembly of Infineon transistor outline
type packages
Acronyms and abbreviations
Acronyms and abbreviations
AOI ………………………………………… automated optical inspection
AXI ………………………………………… automated X-ray inspection
CSAM ………………………………………… c-scanning acoustic microscopy
DSO ………………………………………… dual small outline package
ESD ………………………………………… electrostatic discharge
HDSOP ………………………………………… heatspreader dual small outline package
HSOG ………………………………………… heatsink small outline gullwing
IGBT ………………………………………… insulated-gate bipolar transistor
I/O ………………………………………… input/output
K/W ………………………………………… Kelvin per Watts
MOSFET …..….….….…....….………….…..… metal-oxide-semiconductor field-effect transistor
MSL ……...………………………….……… moisture-sensitivity level
NSMD ……...………………………….……… non-solder mask defined
PG ………………………………………… plastic green
PCB ………………………………………… printed circuit board
SAC ………………………………………… tin silver copper (SnAgCu)
Si ………………………………………… silicon
SiC ………………………………………… silicon carbide
SMD ………………………………………… colder mask defined pad
SMD ………………………………………… surface-mount device
SMT ………………………………………… surface-mount technology
Sn ………………………………………… matte tin plating
TCoB ………………………………………… temperature cycling on board
THD ………………………………………… through-hole device
THT ………………………………………… through-hole technology
TO ………………………………………… transistor outline package
TOLG ………………………………………… transistor outline leaded with gullwing package
TOLT ………………………………………… transistor outline leaded top-side cooling package