• Do not place the device in extremely hot (refer to the specification of the device for the detailed
operating temperature), cold, dusty or damp locations, and do not expose it to high
electromagnetic radiation.
• The device cover for indoor use shall be kept from rain and moisture.
• Exposing the equipment to direct sun light, low ventilation or heat source such as heater or
radiator is forbidden (ignorance can cause fire danger).
• Do not aim the device at the sun or extra bright places. A blooming or smear may occur
otherwise (which is not a malfunction however), and affecting the endurance of sensor at the
same time.
• Please use the provided glove when open up the device cover, avoid direct contact with the
device cover, because the acidic sweat of the fingers may erode the surface coating of the device
cover.
• Please use a soft and dry cloth when clean inside and outside surfaces of the device cover, do
not use alkaline detergents.
• Please keep all wrappers after unpack them for future use. In case of any failure occurred, you
need to return the device to the factory with the original wrapper. Transportation without the
original wrapper may result in damage on the device and lead to additional costs.
• Improper use or replacement of the battery may result in hazard of explosion. Replace with the
same or equivalent type only. Dispose of used batteries according to the instructions provided by
the battery manufacturer.
• You can view the device License via the website: http://opensource.hikvision.com/Home/List?
id=46.
DS-K1T804B Series Fingerprint Access Control Terminal User Manual
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