12 SBC330 3U VPX Single Board Computer
Publication No. SBC330-0HH/3
1.5.4 Flammability
The
SBC330
circuit
board
is
made
by
a
UL
‐
recognized
manufacturer
and
has
a
flammability
rating
of
UL94V
‐
1.
1.5.5 EMI/EMC regulatory compliance
CAUTION
This equipment generates, uses, and can radiate electromagnetic energy. It may cause or be
susceptible to EMI if not installed and used in a cabinet with adequate EMI protection.
The
SBC330
is
designed
using
good
EMC
practices
and,
when
used
in
a
suitably
EMC
‐
compliant
chassis,
should
maintain
the
compliance
of
the
total
system.
The
SBC330
also
complies
with
EN60950
(product
safety),
which
is
essentially
the
requirement
for
the
Low
Voltage
Directive
(73/23/EEC).
Air
‐
cooled
build
levels
of
the
SBC330
are
designed
for
use
in
systems
meeting
VDE
class
B,
EN
and
FCC
regulations
for
EMC
emissions
and
susceptibility.
Conduction
‐
cooled
build
levels
of
the
SBC330
are
designed
for
integration
into
EMC
hardened
cabinets/boxes.
1.6 Handling
CAUTION
Only handle the board at the edges, heatsink, or front panel.
1.7 Heatsink
CAUTION
Do not remove the heatsink.
The
heatsink
is
thermally
bonded
to
the
ICs
and
will
generally
not
separate
from
the
board
by
removal
of
the
screws
alone.
There
are
no
user
‐
alterable
components
underneath
the
heatsink,
so
users
should
have
no
reason
to
remove
it.
With
the
SBC330,
the
SODIMM
cover
may
be
removed
and
reattached
by
a
user.
In
rare
instances
a
user
may
be
specifically
instructed
to
remove
a
heatsink
cover
by
GE
staff.
However,
this
does
not
mean
that
users
should
attempt
reattachment
of
the
heatsink,
as
this
requires
precise
torque
on
the
securing
screws.
Over
‐
tightening
the
screws
may
cause
the
heatsink
to
damage
components
beneath
it.
Removal
and
re
‐
attachment
of
the
heatsink
should
only
be
carried
out
by
the
factory
.
